SHF: Small: Collaborative Research: Managing Thermal Integrity in Monolithic 3D Integrated Systems

Sponsor: National Science Foundation

Award Number: CCF-1909027

Abstract:

Monolithic three-dimensional (M3D) technology is an emerging integrated circuit (IC) paradigm to maintain the exponential growth in transistor density in future computing platforms. At a time when the fundamental limits of conventional scaling are fast approaching, M3D ICs have the potential to enhance energy efficiency at lower cost. A fundamental challenge in building complex M3D ICs is to efficiently control the on-chip temperature. This project will develop a systematic framework to assess chip-level thermal characteristics and ensure thermal integrity in M3D ICs. Since temperature management is one of the most challenging roadblocks for emerging M3D systems, the proposed research will have a transformative impact on future semiconductor electronics. The methodologies to be developed will be tightly coupled with recent advances in M3D fabrication process, thereby strengthening the applicability and impact of this research.

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This award reflects NSF’s statutory mission and has been deemed worthy of support through evaluation using the Foundation’s intellectual merit and broader impacts review criteria.

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