CI-New: Collaborative Research: Modeling the Next-Generation Hybrid Cooling Systems for High-Performance Processors

Sponsor: National Science Foundation (NSF)

Award Number: CNS-1730316

Abstract:

Design of future high-performance chips is hindered by severe temperature challenges. For example, existing cooling mechanisms cannot efficiently cool the extremely high power densities that are expected in exascale systems. Emerging cooling technologies, which may address these temperature challenges, are not easily accessible for experimentation to computer engineers. In fact, there is a substantial lag before a cooling technology becomes available for system design and optimization. Such lags cause design quality to be left on the table. To this end, this project proposes a software infrastructure that enables accurate modeling of cutting-edge cooling methods and that facilitates mutually customizing the computing and cooling systems to dramatically push system energy efficiency.

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